Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference38 articles.
1. The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction;Yu;J Alloys Compd,2008
2. Interfacial fracture toughness of Pb-free solders;Hayes;Microelectron Reliab,2009
3. Kumar P, Huang Z, Dutta I, Mahajan R, Renavikar M, Sidhu R. Roles of process and microstructural parameters on mixed mode fracture of Sn-Ag-Cu solder joints under dynamic loading conditions. In: IPACK; 2009. p. 389–96.
4. R-curve behavior of Cu–Sn3.0Ag0.5Cu solder joints: effect of mode ratio and microstructure;Nadimpalli;Mater Sci Eng A – Struct,2010
5. Modeling the failure of intermetallic/solder interfaces;Yao;Intermetallics,2010
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