Modeling the failure of intermetallic/solder interfaces
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference29 articles.
1. Reliability of lead-free interconnections under consecutive thermal and mechanical loadings
2. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
3. Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packaging
4. A Unified Creep-Plasticity Theory for Solder Alloys
5. Constitutive and damage model for a lead-free solder
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