A new unified creep‐plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading-Reference-Cited by-同舟云学术

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A new unified creep‐plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading

Published:2022-12-23 Issue:4 Volume:46 Page:1413-1425
ISSN:8756-758X
Container-title:Fatigue & Fracture of Engineering Materials & Structures
language:en
Short-container-title:Fatigue Fract Eng Mat Struct

Author:

Long Xu¹^ORCID,Guo Ying¹,Su Yutai¹^ORCID,Siow Kim S.²,Chen Chuantong³

Affiliation:

1. School of Mechanics, Civil Engineering and Architecture Northwestern Polytechnical University Xi'an China

2. Institute of Microengineering and Nanoelectronics Universiti Kebangsaan Malaysia Bangi Malaysia

3. Institute of Scientific and Industrial Research Osaka University Osaka Japan

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shaanxi Province

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/ffe.13935

Reference50 articles.

1. Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate

2. Magnetic nanoparticle-based solder composites for electronic packaging applications

3. A review of lead-free solders for electronics applications

4. Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics

5. A unified creep‐plasticity theory for solder alloys;McDowell DL;ASTM Spec Tech Publ,1994

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1. Stored energy density solution for TSV-Cu structure deformation under thermal cyclic loading based on PINN;International Journal of Plasticity;2024-08

2. Extended constant life diagrams for low cycle fatigue and creep-fatigue assessments of high-temperature structures;Engineering Structures;2024-06

3. Numerical Simulation of Impact Response of Board-Level Packaging Structure;Computational and Experimental Simulations in Engineering;2023-12-01

4. Meso-scale low-cycle fatigue damage of polycrystalline nickel-based alloy by crystal plasticity finite element method;International Journal of Fatigue;2023-10

5. Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles;Journal of Materials Research and Technology;2023-03

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