Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference28 articles.
1. Unveiling the damage evolution of SAC305 during fatigue by entropy generation;Long;Int J Mech Sci,2023
2. Long X, Guo Y, Su Y T, et al. A new unified creep-plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading. Fatig Fract Eng Mater Struct, https://doi.org/10.1111/ffe.13935.
3. New challenges of miniaturization of electronic devices: electromigration and thermomigration in lead-free solder joints;Zhang;Mater Des,2020
4. Enhancing creep resistance of SnBi solder alloy with non-reactive nano fillers: a study using nanoindentation;Shen;J Alloys Compd,2017
5. Recent advances on SnBi low-temperature solder for electronic interconnections;Jiang;J Mater Sci Mater Electron,2021
Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Impacts of temperature gradient on microstructure and properties of Cu/Sn58Bi-0.6B4C NPs/Cu joints fabricated by vacuum thermal compression bonding;Materials Today Communications;2024-03
2. Orthogonal design optimization for Cu/Sn58Bi-0.4Mg/Cu solder joint strength in ultrasonic-assisted soldering;Materials Today Communications;2024-03
3. Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder;2024
4. Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles;Journal of Materials Research and Technology;2024-01
5. Comprehensive analysis of Sn58Bi/Cu solder joints reinforced with Mg particles: Wettability, thermal, mechanics, and microstructural characterization;Journal of Materials Research and Technology;2023-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3