Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate-Reference-Cited by-同舟云学术

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Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate

Published:2004-11 Issue:1-2 Volume:381 Page:151-157
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Yoon Jeong-Won,Lee Young-Ho,Kim Dae-Gon,Kang Han-Byul,Suh Su-Jeong,Yang Cheol-Woong,Lee Chang-Bae,Jung Jong-Man,Yoo Choong-Sik,Jung Seung-Boo

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference21 articles.

1. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

2. Interfacial reactions between a Pb-Free solder and die backside metallizations

3. Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate

4. http://www.nemi.org/projects/ese/if_assembly.html.

5. Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates

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1. Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint;Journal of Materials Science: Materials in Electronics;2024-01

2. Phase Field Simulation of Intermetallic Compound Evolution at the Interface of Copper–Tin Coating Under Thermal–Mechanical–Electrical Diffusion Coupling;Journal of Electronic Materials;2023-03-03

3. Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution;International Journal of Fatigue;2023-02

4. A new unified creep‐plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading;Fatigue & Fracture of Engineering Materials & Structures;2022-12-23

5. Wettability and Rheological Behavior of Low Ag Lead-Free SAC/Graphene and Cobalt-Graphene Nanocomposite Solder Paste;Metallurgical and Materials Transactions A;2022-05-11

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