Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability-Reference-Cited by-同舟云学术

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

Published:2001-09 Issue:9 Volume:30 Page:1050-1059
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Anderson I. E.,Foley J. C.,Cook B. A.,Harringa J.,Terpstra R. L.,Unal O.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0129-5.pdf

Reference29 articles.

1. W.J. Plumbridge, C.R. Gagg, and S. Peters, J. Electron. Mater. (in this issue).

2. C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater. 23, 595 (1994).

3. J. Bath, C. Handweker, and E. Bradley, Circuits Assembly (May 2000), pp. 31–40.

4. Challenges and Efforts Toward Commercialization of Lead-free Solder-Road Map 2000 for Commercialization of Lead-free Solder, ver. 1.2, The Japan Electronic Industry Development Association, Lead-free Soldering R&D Project Committee (February 2000), http://wwwjeida.or.jp/english/information/pbfree/roadmap.html.

5. I.E. Anderson, F.G. Yost, J.F. Smith, C.M. Miller, and R.L. Terpstra, U.S. patent 5,527, 628 (18 June 1996).

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