Funder
Fundação de Amparo à Pesquisa do Estado de São Paulo
Publisher
Springer Science and Business Media LLC
Reference28 articles.
1. R.S. Sidhu, M.P. Renavikar, A.A. Dani, M.A. Dudek, Solder paste material technology for elimination of high warpage surface mount assembly defects. U.S. Patent, 0175160 A1 (2014)
2. K.J. Puttlitz and K.A. Stalter, High-temperature lead-free solders with dispersoids, Handbook of Lead-Free Solder Technology for Microelectronic. ed. K.J. Puttlitz, and K.A. Stalter (New York: Marcel Dekker, 2004).
3. W. Zhang, J. Zhao, Z. Yin, N. Zhou, L. Tang, and C. Suo, Study on wettability of low-melting alloy material on copper substrates. Ferroelectrics 549, 160–171 (2019).
4. C.K. Roy, S. Bhavnani, M. Hamilton, W.R. Johnson, R.W. Knight, D.K. Harris, Performance of Low Melt Alloys as Thermal Interface Materials, in IEEE 31st SEMI-THERM Symposium (2015)
5. X. Wu, J. Wu, X. Wang, J. Yang, M. Xia, and B. Liu, Effect of In addition on microstructure and mechanical properties of Sn–40Bi alloys. J. Mater. Sci. 55, 3092–3106 (2020).
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