Study on wettability of low-melting alloy material on copper substrates-Reference-Cited by-同舟云学术

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Study on wettability of low-melting alloy material on copper substrates

Published:2019-09-10 Issue:1 Volume:549 Page:160-171
ISSN:0015-0193
Container-title:Ferroelectrics
language:en
Short-container-title:Ferroelectrics

Author:

Zhang Wenbin¹,Zhao Jiali¹,Yin Zhihong¹,Zhou Nianrong²³,Tang Lijun²,Suo Chunguang⁴

Affiliation:

1. Faculty of Mechanical and Electrical Engineering, Kunming University of Science and Technology, Kunming, China;

2. Electric Power Research Institute, Yunnan Power Grid Co., Ltd, Kunming, China;

3. School of Electrical Engineer, Chongqing University, Chongqing, China;

4. Faculty of Science, Kunming University of Science and Technology, Kunming, China

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/00150193.2019.1592557

Reference11 articles.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces;Metals;2024-08-25

2. Long-Term Microstructural Stability of Sn-40Bi and Sn-40Bi-10In Alloys;Journal of Electronic Materials;2024-03-08

3. Effects of Indium on Wetting and Interfacial Features of a Sn-40Bi Alloy in a Copper Substrate;Journal of Electronic Materials;2023-02-07

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