A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading-Reference-Cited by-同舟云学术

A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading

Published:2022-04-20 Issue:7 Volume:45 Page:1953-1968
ISSN:8756-758X
Container-title:Fatigue & Fracture of Engineering Materials & Structures
language:en
Short-container-title:Fatigue Fract Eng Mat Struct

Author:

Zhang Zhao¹,Liu Sheng¹²³⁴,Ma Kun¹,Shi Tielin³,Qian Zhengfang⁵,Liang Kang¹,Dong Fang⁴

Affiliation:

1. Laboratory for Electronic Manufacturing and Packaging Integration, The Institute of Technological Sciences Wuhan University Wuhan China

2. The Key Laboratory of Transients in Hydrolic Machinery of Ministry of Education, School of Power and Mechanical Engineering Wuhan University Wuhan China

3. School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan China

4. School of Microelectronics Wuhan University Wuhan China

5. College of Physics and Optoelectronic Engineering Shenzhen University Shenzhen China

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/ffe.13713

Reference61 articles.

1. System in package (SiP) technology: fundamentals, design and applications

2. Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

3. Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects

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