A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths-Reference-Cited by-同舟云学术

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A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths

Published:2024-03 Issue: Volume:209 Page:113765
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Liu Shuang,Ma Limin,Geng Zelin,Wang Yuwei,Zhen Cheng,Li Dan,Wang Yishu,Jia Qiang,Guo Fu

Funder

National Natural Science Foundation of China

Beijing Municipal Science and Technology Commission, Adminitrative Commission of Zhongguancun Science Park

Publisher

Elsevier BV

Reference42 articles.

1. Reliability issues of lead-free solder joints in electronic devices;Jiang;Sci. Technol. Adv. Mater.,2019

2. A review of lead-free solders for electronics applications;Cheng;Microelectron. Reliab.,2017

3. Recent progress in SLID bonding in novel 3D-IC technologies;Sun;J. Alloys Compd.,2020

4. Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products;Tu;Sci. China-Technol. Sci.,2013

5. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011

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