3D photonics as enabling technology for deep 3D DRAM stacking-Reference-Cited by-同舟云学术

3D photonics as enabling technology for deep 3D DRAM stacking

Published:2019-09-30 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the International Symposium on Memory Systems
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Author:

Werner Sebastian¹,Fotouhi Pouya¹,Xiao Xian¹,Fariborz Marjan¹,Yoo S. J. Ben¹,Michelogiannakis George²,Vasudevan Dilip²

Affiliation:

1. University of California

2. Lawrence Berkeley National Laboratory

Funder

National Science Foundation

U.S. Department of Defense

U.S. Department of Energy

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3357526.3357559

Reference129 articles.

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3. GARNET: A detailed on-chip network model inside a full-system simulator

4. PHENIC: silicon photonic 3D-network-on-chip architecture for high-performance Heterogeneous many-core system-on-chip

5. Improving system energy efficiency with memory rank sub-setting;Ahn Jung Ho;ACM Transactions on Architecture and Code Optimization (TACO),2012

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