A 22nm 832Kb Hybrid-Domain Floating-Point SRAM In-Memory-Compute Macro with 16.2-70.2TFLOPS/W for High-Accuracy AI-Edge Devices
Author:
Affiliation:
1. National Tsing Hua University,Hsinchu,Taiwan
2. Industrial Technology Research Institute,Hsinchu,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10067248/10067251/10067527.pdf?arnumber=10067527
Reference6 articles.
1. A 28nm 1Mb Time-Domain Computing-in-Memory 6T-SRAM Macro with a 6.6ns Latency, 1241GOPS and 37.01TOPS/W for 8b-MAC Operations for Edge-Al Devices;wu;ISSCC,2022
2. 9.1 A 7nm 4-Core AI Chip with 25.6TFLOPS Hybrid FP8 Training, 102.4TOPS INT4 Inference and Workload-Aware Throttling
3. A 28nm 29.2TFLOPS/W BF16 and 36.5TOPS/W INT8 Reconfigurable Digital CIM Processor with Unified FP/INT Pipeline and Bitwise In-Memory Booth Multiplication for Cloud Deep Learning Acceleration
4. A 5-nm 254-TOPS/W 221-TOPS/mm2 Fully-Digital Computing-in-Memory Macro Supporting Wide-Range Dynamic-Voltage-Frequency Scaling and Simultaneous MAC and Write Operations
5. 16.3 A 28nm 384kb 6T-SRAM Computation-in-Memory Macro with 8b Precision for AI Edge Chips
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1. Toggle Rate Aware Quantization Model Based on Digital Floating-Point Computing-In-Memory Architecture;IEEE Transactions on Circuits and Systems II: Express Briefs;2024-06
2. A 19.7 TFLOPS/W Multiply-less Logarithmic Floating-Point CIM Architecture with Error-Reduced Compensated Approximate Adder;2024 IEEE International Symposium on Circuits and Systems (ISCAS);2024-05-19
3. H3D-Transformer: A Heterogeneous 3D (H3D) Computing Platform for Transformer Model Acceleration on Edge Devices;ACM Transactions on Design Automation of Electronic Systems;2024-04-22
4. A reconfigurable in‐memory‐computation architecture with in‐situ update and shift capability;Electronics Letters;2024-04
5. 34.1 A 28nm 83.23TFLOPS/W POSIT-Based Compute-in-Memory Macro for High-Accuracy AI Applications;2024 IEEE International Solid-State Circuits Conference (ISSCC);2024-02-18
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