Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management-Reference-Cited by-同舟云学术

Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management

Published:2022 Issue: Volume:10 Page:59259-59269
ISSN:2169-3536
Container-title:IEEE Access
language:
Short-container-title:IEEE Access

Author:

Kochupurackal Rajan Sreejith¹^ORCID,Ramakrishnan Bharath²,Alissa Husam²^ORCID,Kim Washington²,Belady Christian²,Bakir Muhannad S¹

Affiliation:

1. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

2. Microsoft CO+I, Redmond, WA, USA

Funder

Institute for Electronics and Nanotechnology, Georgia Tech, a member of the National Nanotechnology Coordinated Infrastructure (NNCI), through the National Science Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering

Link

https://ieeexplore.ieee.org/ielam/6287639/9668973/9785822-aam.pdf

Reference55 articles.

1. CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling

2. Cost-Efficient Overclocking in Immersion-Cooled Datacenters

3. High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices

4. Advanced System Integration for High Performance Computing with Liquid Cooling

5. Experimental study on liquid flow and heat transfer in micro square pin fin heat sink

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