Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density
Author:
Affiliation:
1. Georgia Institute of Technology,Atlanta,USA
2. Microsoft CO+I,Redmond,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564954.pdf?arnumber=10564954
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4. Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management
5. Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling
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