3D silicon integration-Reference-Cited by-同舟云学术

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3D silicon integration

Published:2008-05 Issue: Volume: Page:
ISSN:
Container-title:2008 58th Electronic Components and Technology Conference
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Author:

Knickerbocker J.U.,Andry P.S.,Dang B.,Horton R.R.,Patel C S.,Polastre R.J.,Sakuma K.,Sprogis E.S.,Tsang C.K.,Webb B.C.,Wright S.L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4542565/4549927/04550025.pdf?arnumber=4550025

Cited by 113 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. A novel heat transfer characterization method for a thermal management scheme of 3D-IC chips;Measurement;2024-02

3. The HRDL Interposer Technology Using Metal/Polymer Hybrid Bonding and Its Characteristics;IEEE Transactions on Materials for Electron Devices;2024

4. The Effect of Cu/SiO₂ Rough Interface on TSV Electroplating Process for Electronic Packaging;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

5. Predicting Electrical Resistivity of Sintered Copper Nanoparticles From Simulations for the Microscale Selective Laser Sintering Process;Journal of Micro- and Nano-Manufacturing;2023-03-01

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