Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management
Author:
Affiliation:
1. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA
2. Microsoft CO+I, Redmond, WA, USA
Funder
Institute for Electronics and Nanotechnology, Georgia Tech, a member of the National Nanotechnology Coordinated Infrastructure (NNCI), through the National Science Foundation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering
Link
https://ieeexplore.ieee.org/ielam/6287639/9668973/9785822-aam.pdf
Reference55 articles.
1. CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling
2. Cost-Efficient Overclocking in Immersion-Cooled Datacenters
3. High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices
4. Advanced System Integration for High Performance Computing with Liquid Cooling
5. Experimental study on liquid flow and heat transfer in micro square pin fin heat sink
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