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High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices

  • Published:2019-07 Issue:7 Volume:34 Page:6601-6612
  • ISSN:0885-8993
  • Container-title:IEEE Transactions on Power Electronics
  • language:
  • Short-container-title:IEEE Trans. Power Electron.

Author:

Wei TiweiORCID,Oprins HermanORCID,Cherman Vladimir,Qian JunORCID,De Wolf IngridORCID,Beyne Eric,Baelmans Martine

Funder

imec Industrial Affiliation Program on 3D System Integration

imec Reliability, Electrical testing, Modeling and 3D technology teams

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 49 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In-Chip Microfluidic Cooling Integrated on GaN Power IC Reaching High Power Density of 78 kW/l;IEEE Transactions on Power Electronics;2024-08

2. Multi-jet impingement cooling in the leading edge of turbine blade using matrix as internal structure;Applied Thermal Engineering;2024-08

3. Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

4. Block level and package level thermal assessment for back side power delivery network.;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Thermal Mitigation Strategy for Backside Power Delivery Network;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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