Through-chip microchannels for three-dimensional integrated circuits cooling

Author:

Ao Lihong,Ramiere AymericORCID

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes

Reference46 articles.

1. Three-dimensional integrated circuits;Topol;IBM J Res Dev.,2006

2. 39th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO’06);Black;IEEE,2006

3. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs);Salvi;IEEE Trans Compon Packaging Manuf Technol.,2021

4. Analysis of critical thermal issues in 3D integrated circuits;Tavakkoli;Int J Heat Mass Transf.,2016

5. A review of the state-of-the-art in electronic cooling;Zhang;E-Prime - Advances in Electrical Engineering, Electronics and Energy.,2021

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