An Energy-efficient Si-integrated Micro-cooler for High Power and Power-density Computing Applications-Reference-Cited by-同舟云学术

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An Energy-efficient Si-integrated Micro-cooler for High Power and Power-density Computing Applications

Published:2024-05-28 Issue: Volume: Page:1025-1029
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Lien Yu-Jen¹,Hsieh Cheng-Chieh¹,Ku Terry¹,Wang Li¹,Chen Po-Ju¹,Yee Kuo-Chung¹,Douglas Yu C. H.¹

Affiliation:

1. Taiwan Semiconductor Manufacturing Company, Ltd,Hsinchu,R.O.C.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565073.pdf?arnumber=10565073

Reference11 articles.

1. A roadmap for heterogeneous integration for the next decade and beyond: an academic perspective;Swaminathan

2. Overclocking in Immersion-Cooled Datacenters

3. Holistic Understanding of Best Engineering Practice to Extend Cooling Limit of Next Generations of GPU

4. Embedded Microjets for Thermal Management of High Power-Density Electronic Devices

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