Overclocking in Immersion-Cooled Datacenters-Reference-Cited by-同舟云学术

Overclocking in Immersion-Cooled Datacenters

Published:2022-07-01 Issue:4 Volume:42 Page:10-17
ISSN:0272-1732
Container-title:IEEE Micro
language:
Short-container-title:IEEE Micro

Author:

Misra Pulkit A.¹^ORCID,Manousakis Ioannis²,Choukse Esha¹,Jalili Majid³,Goiri Inigo¹,Raniwala Ashish²,Warrier Brijesh²,Alissa Husam⁴^ORCID,Ramakrishnan Bharath⁴^ORCID,Tuma Phillip⁵,Belady Christian⁴,Fontoura Marcus²,Bianchini Ricardo¹

Affiliation:

1. Microsoft Research, Redmond, WA, USA

2. Microsoft Azure, Redmond, WA, USA

3. The University of Texas at Austin, Austin, TX, USA

4. Microsoft CO+I, Redmond, WA, USA

5. 3M Company, Saint Paul, MN, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/40/9810878/09749826.pdf?arnumber=9749826

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4. An Energy-efficient Si-integrated Micro-cooler for High Power and Power-density Computing Applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Performance evaluation and optimization of data center servers using single-phase immersion cooling;International Journal of Heat and Mass Transfer;2024-04