Holistic Understanding of Best Engineering Practice to Extend Cooling Limit of Next Generations of GPU-Reference-Cited by-同舟云学术

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Holistic Understanding of Best Engineering Practice to Extend Cooling Limit of Next Generations of GPU

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Refai-Ahmed Gamal¹,Islam Md Malekkul¹,Kabbani H.²,Cader T.³,Alissa Husam⁴,Do Hoa¹

Affiliation:

1. AMD

2. Meta

3. Nividia

4. Microsoft

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013227.pdf?arnumber=10013227

Reference39 articles.

1. Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

2. Microjet Cooler with Distributed Returns

3. A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study

4. High Performance and Subambient Silicon Microchannel Cooling

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization of Low-Loss Liquids With a Double-Concave Fabry–Perot Open Resonator in the 20–50-GHz Range;IEEE Transactions on Microwave Theory and Techniques;2023

2. Invited Talk: Pathfinding to Maximization of AI/HPC/GPC System Performance;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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