Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling-Reference-Cited by-同舟云学术

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Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
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Author:

Zhang H.Y.,Pinjala D.,Poi-Siong Teo

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/8973/28473/01271593.pdf?arnumber=1271593

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Experimental evaluation of direct-to-chip cold plate liquid cooling for high-heat-density data centers;Applied Thermal Engineering;2024-02

2. Guidelines and Experimental Hydraulic performance Evaluation for Single-Phase CDUs Under Steady and Transient Events;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

3. Topology Optimization of an Air-Cooled Heat Sink for Transient Heat Dissipation using a Homogenization Approach;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

4. Thermal Design and Transient Analysis of Liquid Cooling Integrated Rack in Spacecraft Cabin;2022 IEEE 5th International Conference on Electronics Technology (ICET);2022-05-13

5. Current Technologies on Electronics Cooling and Scope for Further Improvement: A Typical Review;Lecture Notes on Multidisciplinary Industrial Engineering;2021-07-25

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