Experimental evaluation of direct-to-chip cold plate liquid cooling for high-heat-density data centers-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Experimental evaluation of direct-to-chip cold plate liquid cooling for high-heat-density data centers

Published:2024-02 Issue: Volume:239 Page:122122
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Heydari Ali,Gharaibeh Ahmad R.^ORCID,Tradat Mohammad,soud Qusai,Manaserh Yaman,Radmard Vahideh,Eslami Bahareh,Rodriguez Jeremy,Sammakia Bahgat

Funder

National Science Foundation

Nvidia

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology,Fluid Flow and Transfer Processes,Mechanical Engineering

Reference37 articles.

1. K. W. Yan, P. Y. Lin, S. L. Kuo, Thermal Challenges for HPC 3DFabricTMPackages and Systems, IEEE International Reliability Physics Symposium Proceedings, vol. 2022-March, pp. 4C11-4C16, 2022, doi: 10.1109/IRPS48227.2022.9764572.

2. I. Sauciuc, G. Chrysler, R. Mahajan, M. Szleper, Air-cooling extension - Performance limits for processor cooling applications, Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 74–81, 2003, doi: 10.1109/STHERM.2003.1194342.

3. Review of thermal packaging technologies for automotive power electronics for traction purposes;Broughton;J. Electron. Packaging, Trans. ASME,2018

4. H. Y. Zhang, D. Pinjala, P.S. Teo, Thermal management of high power dissipation electronic packages: From air cooling to liquid cooling, Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003, pp. 620–625, 2003, doi: 10.1109/EPTC.2003.1271593.

5. Thermal management of air and liquid cooled data centres: A review;Chethana;Mater. Today Proc,2021

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermohydraulics of microfluidic heat sinks with pin-fins: Effect of arrangement and cross-section of the fins;International Communications in Heat and Mass Transfer;2024-12

2. Numerical Evaluation of Hot Air Recirculation in Server Rack;Applied Sciences;2024-09-05

3. Heat transfer performance of novel 3D flat-plate oscillating heat spreader under gravity-assisted and anti-gravity conditions for high-density power electronics cooling;Applied Thermal Engineering;2024-09

4. Optimization of cooling operation strategy for server cabinets based on air-cooled chiller;Journal of Physics: Conference Series;2024-08-01

5. Liquid cooling of data centers: A necessity facing challenges;Applied Thermal Engineering;2024-06

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3