Thermal Challenges for HPC 3DFabric<sup>TM</sup> Packages and Systems-Reference-Cited by-同舟云学术

Thermal Challenges for HPC 3DFabric^TM Packages and Systems

Published:2022-03 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Reliability Physics Symposium (IRPS)
language:
Short-container-title:

Author:

Yan Kathy Wei¹,Lin Po-Yao¹,Kuo Sheng-Liang¹

Affiliation:

1. TSMC,Advanced Packaging Technology and Service,Hsinchu,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9764406/9764408/09764572.pdf?arnumber=9764572

Reference11 articles.

1. TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems

2. Novel graphite-based TIM for high performance computing

3. Advanced Thermal Integration for HPC Packages with Two-Phase Immersion Cooling;lin;unpublished presented at the 72nd Electronic Components and Technology Conference,2022

4. To cool datacenter servers, Microsoft turns to boiling liquid;roach,2021

5. Introduction to Heat Transfer;incropera,1990

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Experimental evaluation of direct-to-chip cold plate liquid cooling for high-heat-density data centers;Applied Thermal Engineering;2024-02

2. Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-12

3. Low-melting metal thermal interface material for high-power package application;Journal of the Korean Physical Society;2023-07-28

4. A Novel Stacked-via Cu/ELK Interconnection Design Configuration to Enhance Advanced Si Packages Reliability Performance;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs);2023 IEEE International Reliability Physics Symposium (IRPS);2023-03