Thermal Challenges for HPC 3DFabric<sup>TM</sup> Packages and Systems-Reference-Cited by-同舟云学术

Thermal Challenges for HPC 3DFabric^TM Packages and Systems

Published:2022-03 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Reliability Physics Symposium (IRPS)
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Author:

Yan Kathy Wei¹,Lin Po-Yao¹,Kuo Sheng-Liang¹

Affiliation:

1. TSMC,Advanced Packaging Technology and Service,Hsinchu,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9764406/9764408/09764572.pdf?arnumber=9764572

Reference11 articles.

1. TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems

2. Novel graphite-based TIM for high performance computing

3. Advanced Thermal Integration for HPC Packages with Two-Phase Immersion Cooling;lin;unpublished presented at the 72nd Electronic Components and Technology Conference,2022

4. To cool datacenter servers, Microsoft turns to boiling liquid;roach,2021

5. Introduction to Heat Transfer;incropera,1990

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