Novel graphite-based TIM for high performance computing-Reference-Cited by-同舟云学术

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Novel graphite-based TIM for high performance computing

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Hoffmeyer Mark,Subramanian Prashanth,Beyerle Rick,Mann Phil

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7983314/7991835/07992478.pdf?arnumber=7992478

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Accelerated Stress Testing and Failure Analysis of Thermal Greases;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28

2. Advanced Thermal Integration for HPC Packages with Two-Phase Immersion Cooling;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Thermal Challenges for HPC 3DFabric^TM Packages and Systems;2022 IEEE International Reliability Physics Symposium (IRPS);2022-03

4. An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer;Journal of Electronic Packaging;2020-06-04

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