Author:
Huang Chun Hsien,Huang Hui Ling,Hung Chen I,Wang Na Fu,Wang Yeong Her,Houng Mau Phon
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation of Structure Modification of Underlying SiCOH Low-kDielectrics with Subsequent Hardmask Deposition Process Conditions;Science of Advanced Materials;2021-11-01
2. Surface Analysis of TMCTS-Based SiOC(H) Low-k Dielectrics in Post-Etch Strip of ACL Hardmask;Materials;2021-02-28
3. Effects of He/H2 Plasma Treatment on Properties of SiCOH Films Deposited with the 1,1,1,3,5,7,7,7- Octamethyl-3,5-Bis(Trimethylsiloxy) Tetrasiloxane Precursor;Journal of Nanoscience and Nanotechnology;2020-11-01
4. Impact of VUV photons on SiO2 and organosilicate low-k dielectrics: General behavior, practical applications, and atomic models;Applied Physics Reviews;2019-03
5. Film deposition and UV curing process impact on ultralow-kdielectric for high performance Cu interconnects;Japanese Journal of Applied Physics;2017-06-20