Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1618358
Reference29 articles.
1. Low Dielectric Constant Sicoh Films As Potential Candidates for Interconnect Dielectrics
2. Novel Low-k Dual-phase Materials Prepared by PECVD
3. Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition
4. Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-kto extreme low-kinterconnect materials
5. Porosity in plasma enhanced chemical vapor deposited SiCOH dielectrics: A comparative study
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