EUVL is being inserted in manufacturing in 2019: What are the mask related challenges remaining?
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Publisher
SPIE
Reference8 articles.
1. ASML NXE pellicle update
2. E. Gallager et al, submitted to SPIE PUV2019 Conference
3. Experimental investigation of a high-k reticle absorber system for EUV lithography
4. Novel EUV mask absorber evaluation in support of next-generation EUV imaging
5. Roughness decomposition: an on-wafer methodology to discriminate mask, metrology, and shot noise contributions
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