Affiliation:
1. Institute of Microelectronics of Chinese Academy of Sciences
2. University of Chinese Academy of Sciences
3. Guangdong Greater Bay Area Applied Research Institute of Integrated Circuit and Systems
4. Beijing Institute of Technology
Abstract
Calculating the diffraction near field (DNF) of a three-dimensional (3D) mask is a key
problem in the extreme ultraviolet (EUV) lithography imaging modeling.
This paper proposes a fast DNF model of an EUV mask based on the
asymmetric patch data fitting method. Due to the asymmetric imaging
characteristics of the EUV lithography system, a DNF library is built
up including the training mask patches posed in different orientations
and their rigorous DNF results. These training patches include some
representative local mask features such as the convex corners, concave
corners, and edge segments in four directions. Then, a
convolution-based compact model is developed to rapidly simulate the
DNFs of 3D masks, where the convolution kernels are inversely
calculated to fit all of the training data. Finally, the proposed
model is verified by simulation experiments. Compared to a
state-of-the-art EUV mask model based on machine learning, the
proposed method can further reduce the computation time by 60%–70% and
roughly obtain the same simulation accuracy.
Funder
National Natural Science Foundation of China
Ministry of Science and Technology of the People’s Republic of China
Guangdong Province Research and Development Program in Key Fields
Subject
Atomic and Molecular Physics, and Optics,Engineering (miscellaneous),Electrical and Electronic Engineering
Cited by
2 articles.
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