Formation of a manganese oxide barrier layer with thermal chemical vapor deposition for advanced large-scale integrated interconnect structure
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2963984
Reference9 articles.
1. Self-forming diffusion barrier layer in Cu–Mn alloy metallization
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3. Growth kinetics and thermal stability of a self-formed barrier layer at Cu-Mn∕SiO2 interface
4. In-situ mass spectrometric investigation of tricarbonyl (methylcyclopentadienyl) manganese (TCMn) pyrolysis mechanism during MOVPE
5. Growth and characterization of magnetic metal Mn film by MOCVD
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