Growth kinetics and thermal stability of a self-formed barrier layer at Cu-Mn∕SiO2 interface
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2773699
Reference23 articles.
1. Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization
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