Self-forming diffusion barrier layer in Cu–Mn alloy metallization
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1993759
Reference16 articles.
1. Oxidation resistant high conductivity copper films
2. Low-temperature passivation of copper by doping with Al or Mg
3. Sequence of Mg segregation, grain growth, and interfacial MgO formation in Cu–Mg alloy films on SiO2 during vacuum annealing
4. Kinetics of interfacial reaction in Cu–Mg alloy films on SiO2
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