Kinetics of interfacial reaction in Cu–Mg alloy films on SiO2
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1630355
Reference21 articles.
1. Multilevel interconnections for ULSI and GSI era
2. Low-temperature passivation of copper by doping with Al or Mg
3. Bias-temperature stability of the Cu(Mg)/SiO[sub 2]/p-Si metal-oxide-semiconductor capacitors
4. Capacitance–voltage, current–voltage, and thermal stability of copper alloyed with aluminium or magnesium
5. Oxidation resistant high conductivity copper films
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