Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1321787
Reference10 articles.
1. Future challenges in electronics packaging
2. Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints
3. Spalling of Cu6Sn5spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films
4. Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils
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