Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.369779
Reference7 articles.
1. Future challenges in electronics packaging
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3. High Sn solder reaction with Cu metallization
4. Dewetting of molten Sn on Au/Cu/Cr thin‐film metallization
5. Size dependent dewetting and sideband reaction of eutectic SnPb on Au/Cu/Cr multilayered thin film
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3. Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix;Journal of Materials Science: Materials in Electronics;2022-08-25
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