Spalling of Cu6Sn5spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.363728
Reference5 articles.
1. Studies of the SLT Chip Terminal Metallurgy
2. SLT Device Metallurgy and its Monolithic Extension
3. Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu
4. The formation and growth of intermetallics in composite solder
5. Rate of consumption of Cu in soldering accompanied by ripening
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