Terminal Reaction Behaviors in Micro Bumps: Comparison of Ti and Cr Adhesion Layers
Author:
Affiliation:
1. National Taiwan University,Department of Materials Science and Engineering,Taipei,Taiwan,R.O.C.
Funder
Ministry of Education
Ministry of Science and Technology
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795638.pdf?arnumber=9795638
Reference7 articles.
1. Spalling of Cu6Sn5spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films
2. Dewetting of molten Sn on Au/Cu/Cr thin‐film metallization
3. Ripening‐assisted asymmetric spalling of Cu‐Sn compound spheroids in solder joints on Si wafers
4. Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils
5. A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
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