Author:
Wu Yujing,Sees Jennifer A.,Pouraghabagher Cyrus,Foster L. Ann,Marshall James L.,Jacobs Elizabeth G.,Pinizzotto Russell F.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. D.S. Dunn, T.F. Marinis, W.M. Sherry and C.J. Williams, Mat. Res. Soc. Symp. Proc. 40, 129 (1985).
2. P.E. Davis, M.E. Warwick and S.J. Muckett,Plating and Surface Finishing 70, 49 (1983).
3. J.L. Marshall, “Scanning Electron Microscopy and Energy Dispersive X-Ray (SEM/EDX) Characterization of Solder-Solderability and Reliability,”Solder Joint Reliability: Theory and Applications, ed. J.H. Lau, Van Nostrand Reinhold, New York, 1991, pp. 173–224.
4. P. Blum, J. Pellissier and G. Silvestre,Solid State Techn., p. 55 (1973).
5. K.R. Kinsman, “Introduction: Challenges of Solder Mechanics,”Solder Mechanics: A State of the Art Assessment, eds. D.R. Frear, W.B. Jones and K.R. Kinsman, TMS, Warrendale, PA, 1991, pp. XIX-XXVII.
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