Dependence of Cu/Sn and Cu/60Sn40Pb Solder Joint Strength on Diffusion Controlled Growth of Cu3Sn and Cu6Sn5-Reference-Cited by-同舟云学术

Dependence of Cu/Sn and Cu/60Sn40Pb Solder Joint Strength on Diffusion Controlled Growth of Cu3Sn and Cu6Sn5

Published:1984 Issue: Volume:40 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Dunn D. S.,Marinis T. F.,Sherry W. M.,Williams C. J.

Abstract

AbstractThe growth of intermetallic compounds and the strength of Cu/ Sn and Cu/ 60Sn40Pb butt joints were studied as a function of isothermal aging. The effects of single-crystal (100), (110), and (111) oriented copper on the growth rates of Cu3Sn and Cu6Sn5 intermetallic compounds are characterized and the influence of elevated temperature aging on the tensile strength of butt joints analyzed. Substrate orientation appears to influence the growth rate. Metallographic measurements showed that the intermetallic compounds grew at a rate proportional to the square root of time. Tensile tests of aged butt joints revealed a more complex time dependence.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference17 articles.

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2. [6] Zakraysek L. , “Intermetallic Growth in Tin-Rich Solders,” Welding Research Supplement, November, 536s, (1972).

3. Reaction-Diffusion in the Cu–Sn System

4. Diffusion in the CuSn binary system: application to Nb3Sn composites

5. Interstitial Diffusion of Copper in Tin

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