Author:
Liu Tao,Kim D.,Leung D.,Korhonen M.A.,Li C.-Y.
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
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1. Chip-to-Package Interconnections;Koopman,1989
2. J. Wilcox, private communication.
3. Microstructure evolution of eutectic Sn-Ag solder joints
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