Trace of Ag atoms migration induced by temperature gradient in Cu/Sn-5.0Ag/Cu solder joints
Author:
Funder
Key Technology Research and Development Program of Shandong
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference29 articles.
1. Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures;Chiu;Mater. Lett.,2016
2. Rapid fabrication of Cu/40-μm thick full Cu3Sn/Cu joints by applying pulsed high frequency electromagnetic field for high power electronics;Liu;Mater. Chem. Phys.,2022
3. Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu-Ni bonding;Min;Appl. Surf. Sci.,2021
4. The fracture mechanism of Cu3Sn-microporous copper composite joint by thermal compression bonding process;Sun;Mater. Lett.,2021
5. Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding;Sun;Soldering Surf. Mount Technol.,2021
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