1. Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization;Jang;J Appl Phys,2000
2. Copper pillar bump technology progress overview;Koh,2011
3. Studies on a novel flip-chip interconnect structure;Wang,2011
4. Through silicon via copper electrodeposition for 3D integration;Beica,2008
5. Redistribution layers (RDLs) for 2.5D/3D IC integration. International Symposium on Microelectronics;Lau;Int Microelectron Assembly Packag Soc,2013