Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.371751
Reference11 articles.
1. Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
2. Ripening‐assisted asymmetric spalling of Cu‐Sn compound spheroids in solder joints on Si wafers
3. First order distributed feedback operation in ZnSe based laser structures
4. Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu
5. Effect of Sn content of Pb-Sn solder alloys on wetting dynamics
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