Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder
Author:
Affiliation:
1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
2. School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210016, China
Abstract
Funder
Key Laboratory of Advanced Welding Technology of Jiangsu Province
Publisher
Hindawi Limited
Subject
General Engineering,General Materials Science
Link
http://downloads.hindawi.com/journals/amse/2017/9750323.pdf
Reference16 articles.
1. Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr
2. Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder
3. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
4. Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
5. Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products
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1. Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry;Microelectronics Reliability;2022-08
2. Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11
3. Microstructure, mechanical properties and corrosion analysis of Sn–0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method;Journal of Materials Science: Materials in Electronics;2021-07-28
4. Effects of gallium, phosphorus and nickel addition in lead-free solders: A review;Materials Today: Proceedings;2021
5. Effects of Ga Additives on the Thermal and Wetting Performance of Sn-0.7Cu Solder;Journal of Electronic Materials;2019-04-01
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