Effects of Ga Additives on the Thermal and Wetting Performance of Sn-0.7Cu Solder-Reference-Cited by-同舟云学术

Effects of Ga Additives on the Thermal and Wetting Performance of Sn-0.7Cu Solder

Published:2019-04-01 Issue:6 Volume:48 Page:3970-3978
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hasnine M.,Bozack M. J.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07171-0.pdf

Reference17 articles.

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2. J.W. Evans, A Guide to Lead-Free Solders: Physical Metallurgy and Reliability (New York: Springer, 2007).

3. D. Witkin, J. Electron. Mater. 41, 190 (2012).

4. J. Shen, Y. Pu, D. Wu, Q. Tang, and M. Zhao, J. Mater. Sci.: Mater. Electron. 26, 1572 (2015).

5. Z. Cai, J.C. Suhling, P. Lall, and M.J. Bozack, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, p. 896 (2012).

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