Microstructure, mechanical properties and corrosion analysis of Sn–0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method

Author:

Sonawwanay Puskaraj D.ORCID,Bupesh Raja V. K.ORCID,Mohd Salleh M. A. A.ORCID,Muhammad Noorhafiza BintiORCID,Nazri S. F.ORCID,Gupta ManojORCID

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference58 articles.

1. P.D. Sonawane, V.K. Bupesh Raja, Advances in lead-free solders. Int. J. Mech. Eng. Technol. 10(02), 520–526 (2019). https://www.iaeme.com/MasterAdmin/uploadfolder/IJMET_10_02_053/IJMET_10_02_053.pdf

2. S. Cheng, C.M. Huang, M. Pecht, A review of lead-free solders for electronics applications. Microelectron. Reliab. 75, 77–95 (2017)

3. J. Wang, S. Xue, P. Zhang, P. Zhai, Y. Tao, The reliability of lead-free solder joint subjected to special environment: a review. J. Mater. Sci. Mater. Electron. (2019). https://doi.org/10.1007/s10854-019-01333-w

4. M.A. Fazal, N.K. Liyana, S. Rubaiee, A. Anas, A critical review on performance, microstructure and corrosion resistance of Pb-free solders. Measurement (2019). https://doi.org/10.1016/j.measurement.2018.12.051

5. Y. Liu, B. Ren, M. Zhou, X. Zeng, F. Sun, Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu. J. Mater. Sci. Mater. Electron. 31, 1–10 (2020)

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