Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints
Author:
Funder
Innovative Research Group Project of the National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-11942-9.pdf
Reference39 articles.
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2. X. Bi, X. Hu, Q. Li, Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: experimental and theoretical investigations. Mater. Sci. Eng. A 788, 139589 (2020)
3. L.C. Tsao, Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering. J. Alloys Compd. 509(5), 2326–2333 (2011)
4. M. Turner, D. Callaghan, Will IT in the UK become greener in 2006?—the impact of the new UK regulations on the use of hazardous substances in electrical and electronic equipment. Comput. Law Secur. Rev. 22(2), 172–175 (2006)
5. Z.J. Yang, S.M. Yang, H.S. Yu et al., IMC and creep behavior in lead-free solder joints of Sn-Ag and Sn-Ag-Cu alloy system by SP method. Int. J. Automot. Technol. 15, 1137–1142 (2014)
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