IMC and creep behavior in Lead-free solder joints of Sn-Ag and Sn-Ag-Cu alloy system by SP method
Author:
Publisher
Springer Science and Business Media LLC
Subject
Automotive Engineering
Link
http://link.springer.com/content/pdf/10.1007/s12239-014-0118-3.pdf
Reference16 articles.
1. Abtew, M. and Selvaduray, G. (2000). Lead-free solders in microelec-tronics. Materials Science and Engineering, 27, 95–141.
2. Alizadeh, R., Mahmudi, R. and Esfandyarpour, M. J. (2011). Shear punch creep test: A novel localized method for evaluating creep properties. Scripta Materialia, 64, 442–445.
3. Deng, X., Sidhu, R. S., Johnson, P. and Chawla, N. (2005). Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints. Metallurgical and Materials Transactions, 36A, 55–64.
4. Felton, L. E., Rajan, K., Ficalora, P. J. and Singh, P. (1991). n-Cu6Sn5 precipitates in Cu/PbSn solder joints. Scripta Metallurgica et Materialia, 25, 2329–2333.
5. Joo, D. K., Yu, J. and Shin, S. W. (2003). Creep rupture of lead-free Sn-3.5Ag-Cu solders. J. Electronic Materials 32, 6, 541–547.
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Impact of bonding methods and surface finishes on terminal-substrate reliability in EV power modules;Journal of Materials Science: Materials in Electronics;2024-08
2. Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints;Journal of Materials Science: Materials in Electronics;2024-01
3. Challenge of Establishing Materials Testing Standards with Miniature Specimen for Solders;Materials Performance and Characterization;2022-04-05
4. Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review;Journal of Materials Science: Materials in Electronics;2021-12-01
5. Morphological Effect on the Intermetallic Compound Layer Growth Kinetics of Metallurgical Joining;Solid State Phenomena;2020-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3