η-Cu6Sn5 precipitates in solder joints
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference3 articles.
1. Effects of intermetallic formation at the interface between copper and lead-tin solder
2. The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solder
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1. Materials and Processes;SPRINGER-PRAX BOOKS;2016
2. IMC and creep behavior in Lead-free solder joints of Sn-Ag and Sn-Ag-Cu alloy system by SP method;International Journal of Automotive Technology;2014-11-26
3. Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders;Microelectronics Reliability;2004-12
4. Solders and Their Metallurgy;Principles of Soldering;2004-04-01
5. Characterization of Lead-Free Solders in Flip Chip Joints;Journal of Electronic Packaging;2003-12-01
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