Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading-Reference-Cited by-同舟云学术

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Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading

Published:2022-05-11 Issue: Volume: Page:
ISSN:
Container-title:2022 45th International Spring Seminar on Electronics Technology (ISSE)
language:
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Author:

Klimtova Marketa¹,Kralova Iva¹,Vesely Petr¹

Affiliation:

1. Czech Technical University in Prague,Faculty of Electrical Engineering,Department of Electrotechnology,Prague,Czech Republic

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9812704/9812706/09812828.pdf?arnumber=9812828

Reference9 articles.

1. Influence of gallium addition in Sn–Ag–Cu lead-fee solder

2. Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

3. Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders

4. Influence of Added Phosphorus and Gallium in Lead-free Bismuth-Tin Alloys on Wetting and Intermetallic Compounds

5. Effect of reflow technology and surface finishes of PCB on solder spreading

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